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Comparing TEC with vapor compression

Time: May 27 2015    Click: 369

Thermoelectric cooler (TEC) is built due to the Peltier effect, which both have the abilities of heating and cooling. When comparing with the traditional cooling method, vapor compression cooling, TEC has the following features: 1) TECs need no refrigerant, so there is no leakage or pollution. 2) Because of no mechanical rotation parts, when TEC works, there are no noise, no wear, long service life, with high reliability and convenient maintenance. 3) The cooling speed and temperature can be adj...(more)

The basic principle of TEC (II)

Time: May 26 2015    Click: 561

The cooling principle of TEC is shown in figure 1. P and N type semiconductors are sandwiched between metal plates, which can form a pathway. Under the action of external electric field, the hole of P type in the point(a) needs to absorb certain energy to improve its own potential energy and then goes into P type semiconductor, so the temperature of the junction can be decreased and the cold contact point is formed. But the hole in the point(b) needs to release the excess energy to enter theshee...(more)

Basic principle of TEC (I)

Time: May 22 2015    Click: 457

In the closed circuit with two different metals, if the temperature of the two contact points keeps different, electric potential difference will generate and at the same time, there will be current through the closed circuit, which is called Seebeck effect. Conversely, in the same closed circuit, when the direct current is supplied, one contact point becomes cold and the other one gets hot, which is called Peltier effect or thermoelectric effect. This phenomenon can directly lead to the inventi...(more)

The advantages and disadvantages of TEC and its development status (II)

Time: May 22 2015    Click: 2103

With the rapid development of science and technology, technical difficulties about material system and manufacturing technology have been solved. At home, there has been ceramic technology to produce the TEC cooling materials and the standard of the materials can be in the international advanced level. Whats more, the merit of figure of high efficient TEC with Chinas independent intellectual property rights has improved a lot and can be over 1310-3K. Now when in the temperature difference of 50℃...(more)

The advantages and disadvantages of TEC and its development status (I)

Time: May 21 2015    Click: 569

Thermoelectric cooler (TEC) is an ancient technology. As early as in the 1950s, TEC has once set off a boom. When it is connected to a power supply, it can become cold, which is very popular among home appliance manufacturers. However, because of the poor performance of components, it failed to be applied in actual life. The key, which determines the rise of decline of materials and process of TEC, is to improve figure of merit and the cooling effect of the hot and cold end. In order to meet the...(more)

Practical application of TECs

Time: May 20 2015    Click: 391

CPU of computer is a high density heating element. Based on the cooling principle of thermoelectric cooler (TEC), the cold end of TEC is in contact with the display chip and the hot end is in contact with the heat sink . When connecting a power supply, the temperature difference of the cold and hot end will come out and moves from the cold end to the hot end through lattice energy. Only if the hot end heat can be dissipated effectively, the cold end will be cooling constantly and the cooling eff...(more)

Some other heat-dissipation methods of TEC

Time: May 19 2015    Click: 348

1.Using endothermic phenomenon of material melting When a material is melting, it will absorb the heat from the hot end of thermopile in the isothermal condition. The isothermal characteristic is the necessary condition of maintaining the cold end constant. The time for the melting stage is the temperature constant time of the cold end. Because of different material thermal conductivities, the heat transfer temperature difference is also different, the thermal conductivity is low and the tempera...(more)

Installation of TECs in Thermo-electric Cooling System (II)

Time: May 18 2015    Click: 273

In some specified applications, the main method is to use a special high thermal conductive epoxy resin binder. Since the coefficients of thermal expansion of the ceramics of TEC s, heat sink and the cooled object, its not recommended to use epoxy resin binder in large TECs. The detailed steps are as follows: (a) Flat the installing surface of the TEC by lathe machine or polishing method. Although it doesnt need high flatness when using epoxy resin, but usually the surface should be flat as much...(more)

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